Evaluating ICs as Sources of Radiated Emissions
Integrated circuits are often the source of unintentional radiated emissions, but they are not the "antenna". ICs must couple their energy to circuit board traces, cables, enclosures, or other larger objects before that energy can be radiated. The goal of this project was to identify specific component-level IC test procedures that yield the information necessary to perform system-level EMC simulations. All coupling is divided into three categories: conducted, near-field electric, and near-field magnetic. Tests were developed to identify an IC's ability to couple electromagnetic energy through each of these mechanisms. Publications[1] H. Shim and T. Hubing, “Model for estimating radiated emissions from a printed circuit board with attached cables due to voltage-driven sources,” IEEE Transactions on Electromagnetic Compatibility, vol. 47, no. 4, Nov. 2005, pp. 899-907. [2] S. Deng, T. Hubing and D. Beetner, “Characterizing the electric-field coupling from IC-heatsink structures to external cables using TEM-cell measurements,” IEEE Transactions on Electromagnetic Compatibility, vol. 49, no. 4, Nov. 2007, pp. 785-791. [3] T. Hubing, S. Deng, and D. Beetner, “Using electric and magnetic ‘moments’ to characterize IC coupling to cables and enclosures,” Proceedings of EMC Compo 2007 Conference, Turin, Italy, November 2007. [4] S. Deng, T. Hubing and D. Beetner, “Using TEM cell measurements to estimate the maximum radiation from PCBs with attached cables due to magnetic field coupling,” IEEE Transactions on Electromagnetic Compatibility, vol. 50, no. 2, May 2008, pp. 419-423. PresentationsBuilding IC Models Based on Measurements and Using These Models Productively Using Electric and Magnetic "Moments" to Characterize IC Coupling to Cables and Enclosures |
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