The Clemson Vehicular Electronics Laboratory

EMC Expert System for Printed Circuit Board Layout

Circuit Board

Researchers at Clemson University are working with CAD software developers, circuit designers, and EMC engineers to develop a powerful tool for modeling and predicting electromagnetic interference (EMI) problems. EMI/EMC modeling experts are working together with professional CAE/CAD software developers and state-of-the-art circuit designers representing the computer, aerospace, and automotive electronics industries. The goal of this project is to develop intelligent EMI modeling software that will work with automated printed circuit board layout tools to:

  • review and analyze printed circuit board designs;
  • point out problems with the layout that could result in electromagnetic emissions or electromagnetic susceptibility;
  • estimate levels of radiated EMI;
  • anticipate ESD and radiated susceptibility problems; and
  • provide circuit and board layout design advice.

Unlike numerical EM modeling software or EMC design rule checkers, the software being developed by this project examines boards in much the same manner as a professional EMC engineer. Potential common-mode and differential-mode EMI sources are identified and evaluated. The software looks for EMI antennas on or off the board and evaluates how hard they are being driven. It identifies any problems found with the board layout and estimates the impact of these problems on the radiated EMI from the system.

Two commercial expert system software tools based on the algorithms developed so far have already been released. Quiet Expert from Mentor Graphics and CR5000 Lightning from Zuken are based on principles and algorithms resulting from this project. Both of these tools will continue to get "smarter" and easier to use as work on this project progresses.

Web Link

PCB EMC Expert System Web Page

Publications

  1. T. Hubing, “Performance-based EMC Design using a Maximum Radiated Emissions Calculator,” Journal of Electromagnetic Engineering and Science, vol. 13, no. 4, Dec. 2013, pp. 199-207.
  2. C. Zhu and T. Hubing, “Maximum Radiated Emission Calculator: Common-Mode EMI Algorithm,” Clemson Vehicular Electronics Laboratory Technical Report, CVEL-13-051, Dec. 23, 2013.
  3. C. Zhu and T. Hubing, “Maximum Radiated Emission Calculator: Power Bus Algorithm,” Clemson Vehicular Electronics Laboratory Technical Report, CVEL-13-053, Oct. 12, 2013.
  4. C. Zhu and T. Hubing, “Maximum Radiated Emission Calculator: Differential-Mode EMI Algorithm,” Clemson Vehicular Electronics Laboratory Technical Report, CVEL-13-052, Oct. 12, 2013.
  5. T. Hubing, "Designing Automotive Components for Guaranteed Compliance with Electromagnetic Compatibility Requirements," In Compliance Magazine, May 2013.
  6. X. He and T. Hubing, “A Closed-Form Expression for Estimating the Maximum Radiated Emissions from a Heatsink on a Printed Circuit Board,” IEEE Trans. on Electromagnetic Compatibility, vol. 54, no. 1, Feb. 2012, pp. 205-211.
  7. C. Su and T. Hubing, “Calculating Radiated Emissions due to I/O Line Coupling on Printed Circuit Boards using the Imbalance Difference Method,” IEEE Trans. on Electromagnetic Compatibility, vol. 54, no. 1, Feb. 2012, pp. 212-217.
  8. C. Su and T. Hubing, “Improvements to a Method for Estimating the Maximum Radiated Emissions from PCBs with Cables,” IEEE Trans. on Electromagnetic Compatibility, vol. 53, no. 4, Nov. 2011, pp. 1087-1091.
  9. X. He, T. Hubing, H. Ke, N. Kobayashi, K. Morishita and T. Harada, “Calculation of Optimal Ground Post Resistance for Reducing Emissions from Chassis-Mounted Printed Circuit Boards,” IEEE Trans. on Electromagnetic Compatibility, vol. 53, no. 2, May 2011, pp. 475-481.
  10. C. Su and T. Hubing, “Imbalance Difference Model for Common-Mode Radiation from Printed Circuit Boards,” IEEE Trans. on Electromagnetic Compatibility, vol. 53, no. 1, Feb. 2011, pp. 150-156.
  11. X. Dong, H. Weng, D. G. Beetner, T. Hubing, “Approximation of Worst-Case Crosstalk at High Frequencies,” IEEE Trans. on Electromagnetic Compatibility, vol. 53, no. 1, Feb. 2011, pp. 202-208.
  12. H. Zeng, H. Ke, G. Burbui and T. Hubing, “Determining the Maximum Allowable Power Bus Voltage to Ensure Compliance with a Given Radiated Emissions Specification,” IEEE Trans. on Electromagnetic Compatibility, vol. 51, no. 3, Aug. 2009, pp. 868-872.
  13. S. Deng, T. Hubing and D. Beetner, “Estimating Maximum Radiated Emissions from Printed Circuit Boards with an Attached Cable,” IEEE Trans. on Electromagnetic Compatibility, vol. 50, no. 1, Feb. 2008, pp. 215-218.
  14. Y. Fu and T. Hubing, “Analysis of Radiated Emissions from a Printed Circuit Board using Expert System Algorithms,” IEEE Trans. on Electromagnetic Compatibility, vol. 49, no. 1, Feb. 2007, pp. 68-75.
  15. H. Shim and T. Hubing, “A Closed-Form Expression for Estimating Radiated Emissions from the Power Planes in a Populated Printed Circuit Board,”IEEE Trans. on Electromagnetic Compatibility, vol. 48, no. 1, Feb. 2006, pp. 74-81.
  16. H. Shim and T. Hubing, “Model for Estimating Radiated Emissions from a Printed Circuit Board with Attached Cables Due to Voltage-Driven Sources,” IEEE Trans. on Electromagnetic Compatibility, vol. 47, no. 4, Nov. 2005, pp. 899-907.
  17. H. Shim and T. Hubing, “Derivation of a Closed-Form Approximate Expression for the Self-Capacitance of a Printed Circuit Board Trace,” IEEE Trans. on Electromagnetic Compatibility, vol. 47, no. 4, Nov. 2005, pp. 1004-1008.
  18. H. Shim, T. Hubing, T. Van Doren, R. DuBroff, J. Drewniak, D. Pommerenke and R. Kaires, “Expert System Algorithms for Identifying Radiated Emission Problems in Printed Circuit Boards,” Proc. of the 2004 IEEE International Symp. on Electromagnetic Compatibility, Santa Clara, CA, USA, Aug. 2004, pp. 57-62.
  19. M. Xu and T. Hubing, “The Development of a Closed-Form Expression for the Input Impedance of Power-Return Plane Structures,”IEEE Trans. on Electromagnetic Compatibility, vol. 45, no. 3, Aug. 2003, pp. 478-485.
  20. M. Xu and T. Hubing, “Estimating the Power Bus Impedance of Printed Circuit Boards with Embedded Capacitance,” IEEE Transactions on Advanced Packaging, vol. 25, no. 3, Aug. 2002, pp. 424-432.
  21. M. Li, J. Drewniak, S. Radu, J. Nuebel, T. Hubing, R. DuBroff and T. Van Doren, “An EMI Estimate for Shielding-Enclosure Evaluation,” IEEE Trans. on Electromagnetic Compatibility, vol. 43, no. 3, Aug. 2001, pp. 295-304.
  22. D. M. Hockanson, J. L. Drewniak, T. H. Hubing, T. P. Van Doren, F. Sha, C. W. Lam, and L. Rubin, "Quantifying EMI resulting from finite-impedance reference planes,"IEEE Trans. on Electromagnetic Compatibility, vol. 39, no. 4, Nov. 1997, pp. 286-297.
  23. N. Kashyap, T. Hubing, J. Drewniak, and T. Van Doren, "An expert system for predicting radiated EMI from PCBs," Proc. of the 1997 IEEE International Symposium on Electromagnetic Compatibility, Austin, TX, Aug. 1997, pp. 444-449.
  24. D. M. Hockanson, J. L. Drewniak, T. H. Hubing, T. P. Van Doren, F. Sha, and M. Wilhelm, "Investigation of Fundamental EMI Source Mechanisms Driving Common‑Mode Radiation from Printed Circuit Boards with Attached Cables," IEEE Trans. on Electromagnetic Compatibility, vol. 38, no. 4, Nov. 1996, pp. 557-566.
  25. T. Hubing, J. Drewniak, T. Van Doren, and N. Kashyap, "An Expert System Approach to EMC Modeling," Proc. of the 1996 IEEE International Symposium on Electromagnetic Compatibility, Santa Clara, CA, Aug. 1996, pp. 200‑203.

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