VLSI Design for Reduced EMI

Many significant electromagnetic interference (EMI) problems are ultimately caused by poor integrated circuit designs. Often the problem device is not the fastest device and replacing it with another similar device from a different company eliminates the problem. This study evaluated the various design parameters that make the difference between a good integrated circuit and a poor integrated circuit.

Publications

1. S. Deng, T. Hubing and D. Beetner, “ Using TEM cell measurements to estimate the maximum radiation from PCBs with attached cables due to magnetic field coupling,” IEEE Transactions on Electromagnetic Compatibility, vol. 50, no. 2, May 2008, pp. 419-423.
2. S. Deng, T. Hubing and D. Beetner, “Characterizing the electric-field coupling from IC-heatsink structures to external cables using TEM-cell measurements,” IEEE Transactions on Electromagnetic Compatibility, vol. 49, no. 4, Nov. 2007, pp. 785-791.
3. T. Hubing, “Building IC Models Based on Measurements and Using these Models Productively,” Proc. of the 6th International Workshop on EMC of Integrated Circuits - EMC Compo 2007, Turin, Italy, Nov. 2007, pp. 15-18.
4. T. Hubing, S. Deng, and D. Beetner, “Using electric and magnetic ‘moments’ to characterize IC coupling to cables and enclosures,” Proceedings of EMC Compo 2007 Conference, Turin, Italy, November 2007.
5. H. Kwak, H. Ke, B. Lee and T. Hubing, “Plate Orientation Effect on the Inductance of Multi-layer Ceramic Capacitors,” Proc. of the 16th Topical Meeting on Electrical Performance of Electronic Packaging, Atlanta, Georgia, Oct. 2007, pp. 95-98.
6. E. Sicard, S. Ben Dhia, M. Ramdani and T. Hubing, “EMC of Integrated Circuits: A Historical Review,” Proc. of the 2007 IEEE International Symposium on Electromagnetic Compatibility, Honolulu, HI, USA, July, 2007.
7. V. Kasturi, S. Deng, T. Hubing and D. Beetner, “Quantifying Electric and Magnetic Field Coupling from Integrated Circuits with TEM Cell Measurements,” Proc. of the 2006 IEEE International Symposium on Electromagnetic Compatibility, Portland, OR, USA, Aug. 2006, WEPM-1-4.
8. X. Dong, S. Deng, D. Beetner, T. Hubing and T. Van Doren, “Determination of high frequency package currents from near-field scan data,” Proc. of the 2005 IEEE International Symposium on Electromagnetic Compatibility, Chicago, IL, USA, Aug. 2005, pp. 679-683.
9. X. Dong, S. Deng, T. Hubing and D. Beetner, “Analysis of chip-level EMI using near-field magnetic scanning,” Proc. of the 2004 IEEE International Symposium on Electromagnetic Compatibility, Santa Clara, CA, USA, Aug. 2004, pp. 174-177.
10. T. Hubing, D. Beetner, S. Deng and X. Dong, “Radiation mechanisms for semiconductor devices and packages,” Proc. of the 2004 International Symposium on Electromagnetic Compatibility - EMC’04 Sendai, Sendai, Japan, June 2004, 3A1-3.