{"id":897,"date":"2016-04-06T01:38:55","date_gmt":"2016-04-06T05:38:55","guid":{"rendered":"https:\/\/cecas.clemson.edu\/~hongc\/?page_id=897"},"modified":"2025-06-19T13:13:54","modified_gmt":"2025-06-19T17:13:54","slug":"archival-journals","status":"publish","type":"page","link":"https:\/\/cecas.clemson.edu\/~hongc\/archival-journals\/","title":{"rendered":"Archival Journals"},"content":{"rendered":"
\n

2024<\/strong><\/h3>\n

59. Yang, J., Chen, Y., Yang, Z., Dai, L., Choi, H.<\/strong>, and Meng, Z., \u201cUnveiling the Nanoconfinement Effect on Crystallization of Semicrystalline Polymers Using Coarse-Grained Molecular Dynamics simulations,\u201d Polymers<\/em><\/a>, 16<\/strong>, 1155 (2024).<\/p>\n

2023<\/strong><\/h3>\n

58. Absar, S. and Choi, H.<\/strong>, \u201cControlling Size and Shape of Pores during Metal Solidification for Manufacturing of Functionally Graded Metal Foams,\u201d Manufacturing Letters<\/em><\/a>, 35<\/strong>, 350-360 (2023).<\/p>\n

2022<\/strong><\/h3>\n

57. Varma, A., Nassiri, A., Mears, L., Choi, H.<\/strong>, and Zhao, X., \u201cNumerical Study of Chipping during Friction Element Welding,\u201d Manufacturing Letters<\/em><\/a>, 34<\/strong>, 75-77 (2022).<\/p>\n

56. Awate, G., Mahajan, N., and Choi, H.<\/strong>, \u201cInvestigating the Effects of SiC Abrasive Particles on Friction Element Welding,\u201d Manufacturing Letters<\/em><\/a>, 33<\/strong>, 259-271 (2022).<\/p>\n

55. Varma, A., Absar, S., Ruszkiewicz, B., Skorvron, J., Mears, L., Choi, H.<\/strong>, and Zhao, X., \u201cNumerical Study of Temperature Evolution during Friction Element Welding,\u201d Journal of Manufacturing Science and Engineering<\/em><\/a>, 144<\/strong>, 121012 (2022).<\/p>\n

54. Brown, J., Wilson, C., Bohlen, C., Choi, H.<\/strong>, Thompson, L., and Bostwick, J., \u201cFailure Modes and Bonding Strength of Ultrasonically-soldered Glass Joints,\u201d Journal of Materials Processing Technology<\/em><\/a>, 299<\/strong>, 117385 (2022).<\/p>\n

2021<\/strong><\/h3>\n

53. Kothari, A., Choi, H.<\/strong>, Zhao, H., Joseph, P., and Li, G., \u201cStrain rate effects on thermoplastic composites with mechanical interlocking,\u201d Polymer Composites<\/em><\/a>, 42<\/strong>, 6332-6348 (2021).<\/p>\n

52. Flori\u00e1n-Algar\u00edn, D., Li, X.,\u00a0 Choi, H.<\/strong>, and Su\u00e1rez, O., \u201cStudy of the Effect of the A206\/1.0 wt. % \u03b3Al2<\/sub>O3<\/sub> Nanocomposites Content on the Portevin-Le Chatelier Phenomenon in Al\/0.5 wt. % Mg Alloys,\u201d Journal of Composites Science<\/em><\/a>, 5<\/strong>, 163-176 (2021).<\/p>\n

51. Wilson, C., Thompson, L., Choi, H.<\/strong>, and Bostwick, J., \u201cEnhanced Wettability in Ultrasonic-Assisted Soldering to Glass Substrates,\u201d Journal of Manufacturing Processes<\/i><\/a>,\u00a0 64<\/strong>, 276-284 (2021).<\/p>\n

50. Zhang, C. and Choi, H.<\/strong>, \u201cStudy of Segmented Chip Formation in Cutting of High-Strength Lightweight Alloys,\u201d International Journal of Advanced Manufacturing Technology<\/i><\/a>,\u00a0 112<\/strong>, 2683-2703 (2021).<\/p>\n

2020<\/strong><\/h3>\n

49. Absar, S., Tandon, R., and Choi, H.<\/strong>, \u201cStudy about the Effect of Addition of Carbon Nanofibers on the Strain-Rate Sensitivity of Thermoplastic Polymer Matrix Nanocomposites Manufactured by Ultrasonic Processing,\u201d Procedia Manufacturing<\/em><\/a>, 48<\/strong>, 400-406 (2020).<\/p>\n

2019<\/strong><\/h3>\n

48. Brown, J., Maassen, K., Wilson, C., Tilton, P., Thompson, L., Choi, H.<\/strong>, and Bostwick, J., \u201cDevelopment of an Open-sourced Automated Ultrasonic-assisted Soldering System,\u201d Journal of Manufacturing Processes<\/em><\/a>, 47<\/strong>, 284-290 (2019).<\/p>\n

47. Maassen, K., Brown, J., Choi, H.<\/strong>, Thompson, L., and Bostwick, J., \u201cAcoustic Analysis of Ultrasonic Assisted Soldering for Enhanced Adhesion,\u201d Ultrasonics<\/em><\/a>, 101<\/strong>, 106003 (2019).<\/p>\n

46. Absar, S., Ganduri, S.A.V., and Choi, H.<\/strong>, \u201cStudy of the Geometrical Effects of Impeller on the Flow Field in Hybrid Mixing Process for Manufacturing Nanocomposites,\u201d Procedia Manufacturing<\/em><\/a>, 34<\/strong>, 177-185 (2019).<\/p>\n

45. Ruszkiewicz, B.,Skovron, J., Absar, S., Choi, H.<\/strong>, Zhao, X., Mears, L., Abke, T., and Ipekbayrak, K., \u201cParameter Sensitivity and Process Time Reduction for Friction Element Welding of 6061-T6 Aluminum to 1500 MPa Press-Hardened Steel,\u201d SAE International Journal of Materials and Manufacturing<\/em><\/a>, 12<\/strong>, 41-56 (2019).<\/p>\n

2018<\/strong><\/h3>\n

44. Absar, S., Ruszkiewicz, B., Skovron, J., Mears, L., Abke, T., Zhao, X., and Choi, H.<\/strong>, \u201cTemperature Measurement in Friction Element Welding Process with Micro Thin Film Thermocouples,\u201d Procedia Manufacturing<\/em><\/a>, 26<\/strong>, 485-494 (2018).<\/p>\n

43. Hulsey, S., Absar, S., and Choi, H.<\/strong>, \u201cInvestigation of Simultaneous Ultrasonic Processing of Polymer-Nanoparticle Solutions for Electrospinning of Nanocomposite Nanofibers,\u201d Journal of Manufacturing Processes<\/em><\/a>, 34<\/strong>, 776-784 (2018).<\/p>\n

42. Flori\u00e1n-Algar\u00edn, D., Marrero, R., Li, X.,\u00a0 Choi, H.<\/strong>, and Su\u00e1rez, O., \u201cStrengthening of Aluminum Wires Treated with A206\/Alumina Nanocomposites,\u201d Materials<\/em><\/a>, 11<\/strong>, 413-425 (2018).<\/p>\n

2017<\/strong><\/h3>\n

41. Hulsey, S., Absar, S., and Choi, H.<\/strong>, \u201cComparative Study of Polymer Dissolution Techniques for Electrospinning,\u201d Procedia Manufacturing<\/em><\/a>, 10<\/strong>, 652-661 (2017).<\/p>\n

40. Absar, S., Pasumarthi, P., and Choi, H.<\/strong>, \u201cNumerical and Experimental Studies about the Effect of Acoustic Streaming on Ultrasonic Processing of Metal Matrix Nanocomposites (MMNCs),\u201d Journal of Manufacturing Processes<\/em><\/a>, 28<\/strong>, 515-522 (2017).<\/p>\n

39. Ozsoy, I.B., Choi, H.<\/strong>, Joseph, P., Li, G., Luzinov, I., and Zhao, H., \u201cReinforced Thermoplastic Composites with Interfacial Microarchitectural Anchoring: Computational Study,\u201d International Journal of Solids and Structures<\/em><\/a>, 112<\/strong>, 54-64 (2017).<\/p>\n

2016<\/strong><\/h3>\n

38. Pasumarthi, P., Absar, S., and Choi, H.<\/strong>, \u201cThe Effect of Geometrical Parameters on the Characteristics of Ultrasonic Processing for Metal Matrix Nanocomposites (MMNCs),\u201d Journal of Manufacturing Processes<\/em><\/a>, 24<\/strong>, 382-390 (2016).<\/p>\n

37. Cao, C., Chen, L., Xu, J., Choi, H.<\/strong>, and Li, X., \u201cStrengthening Al-Bi-TiC0.7<\/sub>N0.3<\/sub> Nanocomposites by Cu Addition and Grain Refinement,\u201d Materials Science and Engineering A<\/em><\/a>, 651<\/strong>, 332-335 (2016).<\/p>\n

2015<\/strong><\/h3>\n

36. Chen, L., Xu, J., Choi, H<\/strong>., Pozuelo, M., Ma, X., Bhowmick, S., Yang, J., Mathaudhu, S., and Li, X., \u201cProcessing and Properties of Magnesium containing a Dense Uniform Dispersion of Nanoparticles,\u201d Nature<\/em><\/a>, 528<\/strong>, 539-543 (2015).<\/p>\n

35. Ozsoy, I., Li, G., Choi, H.<\/strong>, and Zhao, H., \u201cShape Effects on Nanoparticle Engulfment for Metal Matrix Nanocomposites,\u201d Journal of Crystal Growth<\/em><\/a>, 422<\/strong>, 62-68 (2015).<\/p>\n

34. Xu, J., Chen, L., Choi, H.<\/strong>, and Li, X., \u201cFabrication of Hierarchical Metallic Nanocomposite Core\/Metal Shell Nanostructures by Self-Assembly,\u201d Journal of Nanoscience and nanotechnology<\/em><\/a>, 15<\/strong>, 5479-5483 (2015).<\/p>\n

2014<\/strong><\/h3>\n

33. Xu, J., Estruga, M., Chen, L., Yahata, B., Choi, H.<\/strong>, and Li, X., \u201cUrchin-like AlOOH Nanostructures on Al Microspheres grown via In-Situ Oxide Template,\u201d Materials Science and Engineering B<\/em><\/a>, 188<\/strong>, 89-93 (2014).<\/p>\n

32. Chen, L., Xu, J., Choi, H.<\/strong>, Konishi, H., Jin, S., and Li, X., \u201cRapid Control of Phase Growth by Nanoparticles,\u201d Nature Communications<\/em><\/a>, 5<\/strong>, 3879, (2014).<\/p>\n

2013<\/strong><\/h3>\n

31. Chen, L., Peng, J., Xu, J., Choi, H.<\/strong>, and Li, X., \u201cAchieving Uniform Distribution and Dispersion of a High Percentage of Nanoparticles in Metal Matrix Nanocomposites by Solidification Processing,\u201d Scripta Materialia<\/em><\/a>, 69<\/strong>, 634-637 (2013).<\/p>\n

30. Li, H., Choi, H.<\/strong>, Ma, C., Zhao, J., Jiang, H., Cai, W., Abell, J.A., and Li, X., \u201cTransient Temperature and Heat Flux Measurement in Ultrasonic Joining of Battery Tabs using Thin-film Micro Sensors,\u201d Journal of Manufacturing Science and Engineering<\/em><\/a>, 135<\/strong>, 051015 (2013).<\/p>\n

29. Estruga, M., Chen, L., Choi, H.<\/strong>, Li, X., and Jin, S., \u201cUltrasonic-Assisted Synthesis of Surface-Clean TiB2<\/sub> Nanoparticles and Their Improved Dispersion and Capture in Al-Matrix Nanocomposites,\u201d ACS Applied Materials & Interfaces<\/em><\/a>, 5<\/strong>, 8813-8819 (2013).<\/p>\n

28. Xu, J., Chen, L., Choi, H.<\/strong>, Konishi, H., and Li, X., \u201cAssembly of Metals and Nanoparticles into Novel Nanocomposite Superstructures,\u201d Scientific Reports<\/em><\/a>, 3<\/strong>, 1730 (2013).<\/p>\n

27. Zhao, J., Li, H., Choi, H.<\/strong>, Cai, W., Abell, J.A., and Li, X., \u201cInsertable Thin Film Thermocouples for In Situ Transient Temperature Monitoring in Ultrasonic Metal Welding of Battery Tabs,\u201d Journal of Manufacturing Processes<\/em><\/a>, 15<\/strong>, 136-140 (2013).<\/p>\n

26. Choi, H.<\/strong>, Cho, W., Konishi, H., Kou, S., and Li, X., \u201cNanoparticle-Induced Superior Hot Tearing Resistance of A206 Alloy,\u201d Metallurgical and Materials Transactions A<\/em><\/a>, 44<\/strong>,\u00a0 1897-1907 (2013).<\/p>\n

2012<\/strong><\/h3>\n

25. Erman, A., Groza, J., Li, X., Choi, H.<\/strong>, and Cao, G., \u201cNanoparticle Effects in Cast Mg-1 wt% SiC Nano-composites,\u201d Materials Science and Engineering A<\/em><\/a>, 558<\/strong>, 39-43 (2012).<\/p>\n

24. Xu, J., Chen, L., Choi, H.<\/strong>, and Li, X., \u201cTheoretical Study and Pathway for Nanoparticle Capture during Solidification of metal melt,\u201d Journal of Physics: Condensed Matter<\/em><\/a>, 24<\/strong>, 255304 (2012).<\/p>\n

23. Sun, Y., Choi, H.<\/strong>, Konishi, H., Pikhovich, V., Hathaway, R., Chen, L., and Li, X., \u201cEffect of Core-Shelled Nanoparticles of Carbon-Coated Nickel on Magnesium,\u201d Materials Science and Engineering A<\/em><\/a>, 546<\/strong>, 284-290 (2012).<\/p>\n

22. Chen, L., Konishi, H., Fehrenbacher, A., Ma, C., Xu, J., Choi, H.<\/strong>, Xu, H., Pfefferkorn, F.E., and Li, X., \u201cNovel nanoprocessing route for bulk graphene nanoplatelets reinforced metal matrix nanocomposites,\u201d Scripta Materialia<\/em><\/a>, 67<\/strong>, 29-32 (2012).<\/p>\n

21. Choi, H.<\/strong>, Konishi, H., and Li, X., \u201cAl2<\/sub>O3<\/sub> Nanoparticles induced simultaneous refinement and modification of primary and eutectic Si particles in hypereutectic Al-20Si alloy,\u201d Materials Science and Engineering A<\/em><\/a>, 541<\/strong>, 159-165 (2012).<\/p>\n

20. Choi, H.<\/strong>, Sun, Y., Slater, B., and Li, X., \u201cAZ91D\/TiB2<\/sub> Nanocomposites fabricated by solidification nanoprocessing,\u201d Advanced Engineering Materials<\/em><\/a>, 14<\/strong>, 291-295 (2012).<\/p>\n

19. Choi, H.<\/strong> and Li, X., \u201cRefinement of primary Si and modification of eutectic Si for enhanced ductility of hypereutectic Al-20Si-4.5Cu alloy with addition of Al2<\/sub>O3<\/sub> nanoparticles,\u201d Journal of Materials Science<\/em><\/a>, 47<\/strong>, 3096-3102 (2012).<\/p>\n

18. Choi, H.<\/strong>, Jones, M., Konishi, H., and Li, X., \u201cEffect of combined addition of Cu and aluminum oxide nanoparticles on mechanical properties and microstructure of Al-7Si-0.3Mg alloy,\u201d Metallurgical and Materials Transactions A<\/em><\/a>, 43<\/strong>, 738-746 (2012).<\/p>\n

2011<\/strong><\/h3>\n

17. Choi, H.<\/strong>, Alba-Baena, N., Nimityongskul, S., Jones, M., Wood, T., Sahoo, M., Lakes, R., Kou, S., and Li, X., \u201cCharacterization of hot extruded Mg\/SiC nanocomposites fabricated by casting,\u201d Journal of Materials Science<\/em><\/a>, 46<\/strong>, 2991-2997 (2011).<\/p>\n

2010<\/strong><\/h3>\n

16. Nimityongskul, S., Jones, M., Choi, H.<\/strong>, Lakes, R., Kou, S., and Li, X., \u201cGrain refining mechanisms in Mg-Al alloys with Al4<\/sub>C3<\/sub> microparticles,\u201d Materials Science and Engineering A<\/em><\/a>, 527<\/strong>, 2104-2111 (2010).<\/p>\n

2009<\/strong><\/h3>\n

15. De Cicco, M., Konishi, H., Cao, G., Choi, H.<\/strong>, Turng, L., Perepezko, J., Kou, S., Lakes, R., and Li, X., \u201cStrong, Ductile Magnesium-Zinc Nanocomposites,\u201d Metallurgical and Materials Transactions A<\/em><\/a>, 40<\/strong>, 3038-3045 (2009).<\/p>\n

2008<\/strong><\/h3>\n

14. Cao, G., Choi, H.<\/strong>, Oportus, J., Konish, H., and Li, X., \u201cStudy on Tensile Properties and Microstructure of Cast AZ91D\/AlN Nanocomposites,\u201d Materials Science and Engineering A<\/em><\/a>, 494<\/strong>, 127-131 (2008).<\/p>\n

13. Cao, G., Choi, H.<\/strong>, Konish, H., Kou, S., Lakes, R., and Li, X., \u201cMg-6Zn\/1.5%SiC Nanocomposites Fabricated by Ultrasonic Cavitation-based Solidification Processing,\u201d Journal of Materials Science<\/em><\/a>, 43<\/strong>, 5521-5526 (2008).<\/p>\n

12. Choi, H.<\/strong> and Li, X., \u201cExperimental Investigation of Laser Micromachining of Nickel using Thin Film Micro Thermocouples,\u201d Journal of Manufacturing Science and Engineering<\/em><\/a>, 130<\/strong>, 0210021-8 (2008).<\/p>\n

2007<\/strong><\/h3>\n

11. Choi, H.<\/strong>, Konishi, H., Xu, H., and Li, X., \u201cEmbedding of Micro Thin Film Strain Sensors in Sapphire by Diffusion Bonding,\u201d Journal of Micromechanics and Microengineering<\/em><\/a>, 17<\/strong>, 2248-2252 (2007).<\/p>\n

10. Choi, H.<\/strong> and Li, X., \u201cFabrication and Application of Micro Thin Film Thermocouples for Transient Temperature Measurement in Nanosecond Pulsed Laser Micromachining of Nickel,\u201d Sensors and Actuators A<\/em><\/a>, 136<\/strong>, 118-124 (2007).<\/p>\n

9. Cheng, X., Datta, A., Choi, H.<\/strong>, Zhang, X., and Li, X., \u201cStudy on Embedding and Integration of Microsensors into Metal Structures for Manufacturing Applications,\u201d Journal of Manufacturing Science and Engineering<\/em><\/a>, 129<\/strong>, 416-424 (2007).<\/p>\n

2006<\/strong><\/h3>\n

8. Choi, H.<\/strong> and Li, X., \u201cExperimental Study of Laser-Cheese Interaction for Making of Thin Cheese Slices with Complex Shapes,\u201d Journal of Food Engineering<\/em><\/a>, 75<\/strong>, 90-95 (2006).<\/p>\n

7. Zhang, X., Choi, H.<\/strong>, Datta, A., and Li, X., \u201cDesign, Fabrication and Characterization of Metal Embedded Thin Film Thermocouples with Various Film Thicknesses and Junction Sizes,\u201d Journal of Micromechanics and Microengineering<\/em><\/a>, 16<\/strong>, 900-905 (2006).<\/p>\n

6. Choi, H.<\/strong>, Datta, A., Cheng, X., and Li, X., \u201cMicrofabrication and Characterization of Metal-embedded Thin-Film Thermomechanical Microsensors for Applications in Hostile Manufacturing Environments,\u201d Journal of Microelectromechanical Systems<\/em><\/a>, 15<\/strong>, 322-329 (2006).<\/p>\n

5. Datta, A., Choi, H.<\/strong>, and Li, X., \u201cBatch Fabrication and Characterization of Micro-Thin-Film Thermocouples Embedded in Metal,\u201d Journal of The Electrochemical Society<\/em><\/a>, 153<\/strong>, H89-H93 (2006).<\/p>\n

2005<\/strong><\/h3>\n

4. Datta, A., Choi, H.<\/strong>, Cheng, X., and Li, X., \u201cBatch Microfabrication of Metal-Embedded Micro Thin Film Sensors for Applications in Hostile Environments,\u201d Electrochemical and Solid-State Letters<\/em><\/a>, 8<\/strong>, H94-H96 (2005).<\/p>\n

3. Choi, H.<\/strong>, Yang, Y., and Li, X., \u201cExperimental Study on Integration of Laser-based Additive\/Subtractive Processes for Meso\/Micro Solid Freeform Fabrication,\u201d International Journal of Advanced Manufacturing Technology<\/em><\/a>, 26<\/strong>, 335-341 (2005).<\/p>\n

2. Cheng, X., Choi, H.<\/strong>, Schwieso, P., Datta, A., and Li, X., \u201cMicro Thin Film Sensor Embedded in Metal Structures for In-situ Process Monitoring during Ultrasonic Welding,\u201d Transactions of NAMRI\/SME<\/em><\/a>, 33<\/strong>, 267-272 (2005).<\/p>\n

2002<\/strong><\/h3>\n

1. Li, X., Choi, H.<\/strong>, and Yang, Y., \u201cMicro Rapid Prototyping System for Micro Components,\u201d Thin Solid Films<\/em><\/a>, 420-421<\/strong>, 515-523 (2002).<\/p>\n

<\/p><\/div><\/div>\n

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External Resources<\/h4>\n