The Clemson Vehicular Electronics Laboratory

Component-Level Characterization for System-Level EMC Simulations

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With the proliferation of high-speed electronics and wireless devices in today"s automobiles, full-vehicle electromagnetic simulations are becoming an important part of the automotive design process. Full-vehicle simulations require complete and accurate models for the various electronic components found in the vehicle. Although automotive electronic components are currently subjected to a variety of electromagnetic measurements designed to ensure electromagnetic compatibility, existing measurement procedures do not yield sufficient information about the electromagnetic behavior of components to be useful in full-vehicle simulations. Because of this, there is very little correlation between component-level EMC test data and system-level EMC performance.

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The goal of this project is to identify specific component-level test procedures that will yield the information necessary to perform system-level EMC simulations. The basic approach is to divide all coupling into four categories: conducted, near-field electric, near-field magnetic and radiated. Four independent tests are done on each component to identify its ability to couple to a system through each of these mechanisms. Source models derived from component-level tests are incorporated into full-wave or expert system models of the entire vehicle. By fully characterizing the components as sources independent of their environment, it is possible to accurately predict their behavior in an automotive system. Preliminary results indicate that test procedures employing low/high-impedance artificial networks, hybrid TEM cells, and true component-level radiated emissions measurements are capable of providing all of the component-level information required for system-level EM emissions simulations.




  1. M. Fontana and T. Hubing, “Characterization of CAN Network Susceptibility to EFT Transient Noise,” IEEE Trans. on Electromagnetic Compatibility, vol. 57, no. 2, Apr. 2015, pp. 188-194.
  2. T. Hubing, “Component-Level Characterization for Vehicle-Level Electromagnetic Simulations,” Proc. of the 2010 SAE Congress no. 2010-01-023, Detroit, April 14, 2010.
  3. H. Kwak, H. Ke and T. Hubing, “Measurement Methods to Characterize Conducted EMI Sources,” Proc. of the 7th International Workshop on EMC of Integrated Circuits - EMC Compo 2009, Toulouse, France, Nov. 2009.
  4. S. Deng, T. Hubing and D. Beetner, “Characterizing the Electric Field Coupling from IC Heatsink Structures to External Cables using TEM Cell Measurements,” IEEE Trans. on Electromagnetic Compatibility, vol. 49, pp. 785-791, Nov. 2007.
  5. T. Hubing, S. Deng and D. Beetner, “Using Electric and Magnetic Moments to Characterize IC Coupling to Cables and Enclosures,” Proc. of the 6th International Workshop on EMC of Integrated Circuits (EMC Compo 2007), Turin, Italy, Nov. 2007, pp. 159-162.
  6. S. Deng, T. Hubing and D. Beetner, “Using TEM Cell Measurements to Estimate the Maximum Radiation from PCBs with Attached Cables due to Magnetic Field Coupling,” IEEE Trans. on Electromagnetic Compatibility, vol. 50, no. 2, May 2008, pp. 419-423.


PCB Radiation Mechanisms: Using Component-Level Measurements to Determine System-Level Radiated Emissions
Presented at the 2008 Asia-Pacific Symposium on EMC, May 2008