Archival Journals

2023

58. Absar, S. and Choi, H., “Controlling Size and Shape of Pores during Metal Solidification for Manufacturing of Functionally Graded Metal Foams,” Manufacturing Letters, 35, 350-360 (2023).

2022

57. Varma, A., Nassiri, A., Mears, L., Choi, H., and Zhao, X., “Numerical Study of Chipping during Friction Element Welding,” Manufacturing Letters, 34, 75-77 (2022).

56. Awate, G., Mahajan, N., and Choi, H., “Investigating the Effects of SiC Abrasive Particles on Friction Element Welding,” Manufacturing Letters, 33, 259-271 (2022).

55. Varma, A., Absar, S., Ruszkiewicz, B., Skorvron, J., Mears, L., Choi, H., and Zhao, X., “Numerical Study of Temperature Evolution during Friction Element Welding,” Journal of Manufacturing Science and Engineering, 144, 121012 (2022).

54. Brown, J., Wilson, C., Bohlen, C., Choi, H., Thompson, L., and Bostwick, J., “Failure Modes and Bonding Strength of Ultrasonically-soldered Glass Joints,” Journal of Materials Processing Technology, 299, 117385 (2022).

2021

53. Kothari, A., Choi, H., Zhao, H., Joseph, P., and Li, G., “Strain rate effects on thermoplastic composites with mechanical interlocking,” Polymer Composites, 42, 6332-6348 (2021).

52. Florián-Algarín, D., Li, X.,  Choi, H., and Suárez, O., “Study of the Effect of the A206/1.0 wt. % γAl2O3 Nanocomposites Content on the Portevin-Le Chatelier Phenomenon in Al/0.5 wt. % Mg Alloys,” Journal of Composites Science, 5, 163-176 (2021).

51. Wilson, C., Thompson, L., Choi, H., and Bostwick, J., “Enhanced Wettability in Ultrasonic-Assisted Soldering to Glass Substrates,” Journal of Manufacturing Processes64, 276-284 (2021).

50. Zhang, C. and Choi, H., “Study of Segmented Chip Formation in Cutting of High-Strength Lightweight Alloys,” International Journal of Advanced Manufacturing Technology112, 2683-2703 (2021).

2020

49. Absar, S., Tandon, R., and Choi, H., “Study about the Effect of Addition of Carbon Nanofibers on the Strain-Rate Sensitivity of Thermoplastic Polymer Matrix Nanocomposites Manufactured by Ultrasonic Processing,” Procedia Manufacturing, 48, 400-406 (2020).

2019

48. Brown, J., Maassen, K., Wilson, C., Tilton, P., Thompson, L., Choi, H., and Bostwick, J., “Development of an Open-sourced Automated Ultrasonic-assisted Soldering System,” Journal of Manufacturing Processes, 47, 284-290 (2019).

47. Maassen, K., Brown, J., Choi, H., Thompson, L., and Bostwick, J., “Acoustic Analysis of Ultrasonic Assisted Soldering for Enhanced Adhesion,” Ultrasonics, 101, 106003 (2019).

46. Absar, S., Ganduri, S.A.V., and Choi, H., “Study of the Geometrical Effects of Impeller on the Flow Field in Hybrid Mixing Process for Manufacturing Nanocomposites,” Procedia Manufacturing, 34, 177-185 (2019).

45. Ruszkiewicz, B.,Skovron, J., Absar, S., Choi, H., Zhao, X., Mears, L., Abke, T., and Ipekbayrak, K., “Parameter Sensitivity and Process Time Reduction for Friction Element Welding of 6061-T6 Aluminum to 1500 MPa Press-Hardened Steel,” SAE International Journal of Materials and Manufacturing, 12, 41-56 (2019).

2018

44. Absar, S., Ruszkiewicz, B., Skovron, J., Mears, L., Abke, T., Zhao, X., and Choi, H., “Temperature Measurement in Friction Element Welding Process with Micro Thin Film Thermocouples,” Procedia Manufacturing, 26, 485-494 (2018).

43. Hulsey, S., Absar, S., and Choi, H., “Investigation of Simultaneous Ultrasonic Processing of Polymer-Nanoparticle Solutions for Electrospinning of Nanocomposite Nanofibers,” Journal of Manufacturing Processes, 34, 776-784 (2018).

42. Florián-Algarín, D., Marrero, R., Li, X.,  Choi, H., and Suárez, O., “Strengthening of Aluminum Wires Treated with A206/Alumina Nanocomposites,” Materials, 11, 413-425 (2018).

2017

41. Hulsey, S., Absar, S., and Choi, H., “Comparative Study of Polymer Dissolution Techniques for Electrospinning,” Procedia Manufacturing, 10, 652-661 (2017).

40. Absar, S., Pasumarthi, P., and Choi, H., “Numerical and Experimental Studies about the Effect of Acoustic Streaming on Ultrasonic Processing of Metal Matrix Nanocomposites (MMNCs),” Journal of Manufacturing Processes, 28, 515-522 (2017).

39. Ozsoy, I.B., Choi, H., Joseph, P., Li, G., Luzinov, I., and Zhao, H., “Reinforced Thermoplastic Composites with Interfacial Microarchitectural Anchoring: Computational Study,” International Journal of Solids and Structures, 112, 54-64 (2017).

2016

38. Pasumarthi, P., Absar, S., and Choi, H., “The Effect of Geometrical Parameters on the Characteristics of Ultrasonic Processing for Metal Matrix Nanocomposites (MMNCs),” Journal of Manufacturing Processes, 24, 382-390 (2016).

37. Cao, C., Chen, L., Xu, J., Choi, H., and Li, X., “Strengthening Al-Bi-TiC0.7N0.3 Nanocomposites by Cu Addition and Grain Refinement,” Materials Science and Engineering A, 651, 332-335 (2016).

2015

36. Chen, L., Xu, J., Choi, H., Pozuelo, M., Ma, X., Bhowmick, S., Yang, J., Mathaudhu, S., and Li, X., “Processing and Properties of Magnesium containing a Dense Uniform Dispersion of Nanoparticles,” Nature, 528, 539-543 (2015).

35. Ozsoy, I., Li, G., Choi, H., and Zhao, H., “Shape Effects on Nanoparticle Engulfment for Metal Matrix Nanocomposites,” Journal of Crystal Growth, 422, 62-68 (2015).

34. Xu, J., Chen, L., Choi, H., and Li, X., “Fabrication of Hierarchical Metallic Nanocomposite Core/Metal Shell Nanostructures by Self-Assembly,” Journal of Nanoscience and nanotechnology, 15, 5479-5483 (2015).

2014

33. Xu, J., Estruga, M., Chen, L., Yahata, B., Choi, H., and Li, X., “Urchin-like AlOOH Nanostructures on Al Microspheres grown via In-Situ Oxide Template,” Materials Science and Engineering B, 188, 89-93 (2014).

32. Chen, L., Xu, J., Choi, H., Konishi, H., Jin, S., and Li, X., “Rapid Control of Phase Growth by Nanoparticles,” Nature Communications, 5, 3879, (2014).

2013

31. Chen, L., Peng, J., Xu, J., Choi, H., and Li, X., “Achieving Uniform Distribution and Dispersion of a High Percentage of Nanoparticles in Metal Matrix Nanocomposites by Solidification Processing,” Scripta Materialia, 69, 634-637 (2013).

30. Li, H., Choi, H., Ma, C., Zhao, J., Jiang, H., Cai, W., Abell, J.A., and Li, X., “Transient Temperature and Heat Flux Measurement in Ultrasonic Joining of Battery Tabs using Thin-film Micro Sensors,” Journal of Manufacturing Science and Engineering, 135, 051015 (2013).

29. Estruga, M., Chen, L., Choi, H., Li, X., and Jin, S., “Ultrasonic-Assisted Synthesis of Surface-Clean TiB2 Nanoparticles and Their Improved Dispersion and Capture in Al-Matrix Nanocomposites,” ACS Applied Materials & Interfaces, 5, 8813-8819 (2013).

28. Xu, J., Chen, L., Choi, H., Konishi, H., and Li, X., “Assembly of Metals and Nanoparticles into Novel Nanocomposite Superstructures,” Scientific Reports, 3, 1730 (2013).

27. Zhao, J., Li, H., Choi, H., Cai, W., Abell, J.A., and Li, X., “Insertable Thin Film Thermocouples for In Situ Transient Temperature Monitoring in Ultrasonic Metal Welding of Battery Tabs,” Journal of Manufacturing Processes, 15, 136-140 (2013).

26. Choi, H., Cho, W., Konishi, H., Kou, S., and Li, X., “Nanoparticle-Induced Superior Hot Tearing Resistance of A206 Alloy,” Metallurgical and Materials Transactions A, 44,  1897-1907 (2013).

2012

25. Erman, A., Groza, J., Li, X., Choi, H., and Cao, G., “Nanoparticle Effects in Cast Mg-1 wt% SiC Nano-composites,” Materials Science and Engineering A, 558, 39-43 (2012).

24. Xu, J., Chen, L., Choi, H., and Li, X., “Theoretical Study and Pathway for Nanoparticle Capture during Solidification of metal melt,” Journal of Physics: Condensed Matter, 24, 255304 (2012).

23. Sun, Y., Choi, H., Konishi, H., Pikhovich, V., Hathaway, R., Chen, L., and Li, X., “Effect of Core-Shelled Nanoparticles of Carbon-Coated Nickel on Magnesium,” Materials Science and Engineering A, 546, 284-290 (2012).

22. Chen, L., Konishi, H., Fehrenbacher, A., Ma, C., Xu, J., Choi, H., Xu, H., Pfefferkorn, F.E., and Li, X., “Novel nanoprocessing route for bulk graphene nanoplatelets reinforced metal matrix nanocomposites,” Scripta Materialia, 67, 29-32 (2012).

21. Choi, H., Konishi, H., and Li, X., “Al2O3 Nanoparticles induced simultaneous refinement and modification of primary and eutectic Si particles in hypereutectic Al-20Si alloy,” Materials Science and Engineering A, 541, 159-165 (2012).

20. Choi, H., Sun, Y., Slater, B., and Li, X., “AZ91D/TiB2 Nanocomposites fabricated by solidification nanoprocessing,” Advanced Engineering Materials, 14, 291-295 (2012).

19. Choi, H. and Li, X., “Refinement of primary Si and modification of eutectic Si for enhanced ductility of hypereutectic Al-20Si-4.5Cu alloy with addition of Al2O3 nanoparticles,” Journal of Materials Science, 47, 3096-3102 (2012).

18. Choi, H., Jones, M., Konishi, H., and Li, X., “Effect of combined addition of Cu and aluminum oxide nanoparticles on mechanical properties and microstructure of Al-7Si-0.3Mg alloy,” Metallurgical and Materials Transactions A, 43, 738-746 (2012).

2011

17. Choi, H., Alba-Baena, N., Nimityongskul, S., Jones, M., Wood, T., Sahoo, M., Lakes, R., Kou, S., and Li, X., “Characterization of hot extruded Mg/SiC nanocomposites fabricated by casting,” Journal of Materials Science, 46, 2991-2997 (2011).

2010

16. Nimityongskul, S., Jones, M., Choi, H., Lakes, R., Kou, S., and Li, X., “Grain refining mechanisms in Mg-Al alloys with Al4C3 microparticles,” Materials Science and Engineering A, 527, 2104-2111 (2010).

2009

15. De Cicco, M., Konishi, H., Cao, G., Choi, H., Turng, L., Perepezko, J., Kou, S., Lakes, R., and Li, X., “Strong, Ductile Magnesium-Zinc Nanocomposites,” Metallurgical and Materials Transactions A, 40, 3038-3045 (2009).

2008

14. Cao, G., Choi, H., Oportus, J., Konish, H., and Li, X., “Study on Tensile Properties and Microstructure of Cast AZ91D/AlN Nanocomposites,” Materials Science and Engineering A, 494, 127-131 (2008).

13. Cao, G., Choi, H., Konish, H., Kou, S., Lakes, R., and Li, X., “Mg-6Zn/1.5%SiC Nanocomposites Fabricated by Ultrasonic Cavitation-based Solidification Processing,” Journal of Materials Science, 43, 5521-5526 (2008).

12. Choi, H. and Li, X., “Experimental Investigation of Laser Micromachining of Nickel using Thin Film Micro Thermocouples,” Journal of Manufacturing Science and Engineering, 130, 0210021-8 (2008).

2007

11. Choi, H., Konishi, H., Xu, H., and Li, X., “Embedding of Micro Thin Film Strain Sensors in Sapphire by Diffusion Bonding,” Journal of Micromechanics and Microengineering, 17, 2248-2252 (2007).

10. Choi, H. and Li, X., “Fabrication and Application of Micro Thin Film Thermocouples for Transient Temperature Measurement in Nanosecond Pulsed Laser Micromachining of Nickel,” Sensors and Actuators A, 136, 118-124 (2007).

9. Cheng, X., Datta, A., Choi, H., Zhang, X., and Li, X., “Study on Embedding and Integration of Microsensors into Metal Structures for Manufacturing Applications,” Journal of Manufacturing Science and Engineering, 129, 416-424 (2007).

2006

8. Choi, H. and Li, X., “Experimental Study of Laser-Cheese Interaction for Making of Thin Cheese Slices with Complex Shapes,” Journal of Food Engineering, 75, 90-95 (2006).

7. Zhang, X., Choi, H., Datta, A., and Li, X., “Design, Fabrication and Characterization of Metal Embedded Thin Film Thermocouples with Various Film Thicknesses and Junction Sizes,” Journal of Micromechanics and Microengineering, 16, 900-905 (2006).

6. Choi, H., Datta, A., Cheng, X., and Li, X., “Microfabrication and Characterization of Metal-embedded Thin-Film Thermomechanical Microsensors for Applications in Hostile Manufacturing Environments,” Journal of Microelectromechanical Systems, 15, 322-329 (2006).

5. Datta, A., Choi, H., and Li, X., “Batch Fabrication and Characterization of Micro-Thin-Film Thermocouples Embedded in Metal,” Journal of The Electrochemical Society, 153, H89-H93 (2006).

2005

4. Datta, A., Choi, H., Cheng, X., and Li, X., “Batch Microfabrication of Metal-Embedded Micro Thin Film Sensors for Applications in Hostile Environments,” Electrochemical and Solid-State Letters, 8, H94-H96 (2005).

3. Choi, H., Yang, Y., and Li, X., “Experimental Study on Integration of Laser-based Additive/Subtractive Processes for Meso/Micro Solid Freeform Fabrication,” International Journal of Advanced Manufacturing Technology, 26, 335-341 (2005).

2. Cheng, X., Choi, H., Schwieso, P., Datta, A., and Li, X., “Micro Thin Film Sensor Embedded in Metal Structures for In-situ Process Monitoring during Ultrasonic Welding,” Transactions of NAMRI/SME, 33, 267-272 (2005).

2002

1. Li, X., Choi, H., and Yang, Y., “Micro Rapid Prototyping System for Micro Components,” Thin Solid Films, 420-421, 515-523 (2002).