My team works on both fundamental and applied research and on both experimental and computational research related to metal additive manufacturing. Our current research areas mainly include:
Manufacturing
Improving the manufacturing capabilities of existing laser-based additive manufacturing (AM) processes.
Developing new manufacturing methods – hybrid AM processes – that incorporate secondary processes (e.g., micro-rolling) and/or heat resources (e.g., induction heating) to transform AM technologies.
Materials
In-situ synthesizing advanced metallic and metal-based materials using AM and hybrid AM processes.
Convergent manufacturing of dissimilar materials.
Resolving the metallurgical defects in AM-fabricated alloys and materials.
Physics-based simulations
Multi-scale microstructure modeling.
Crystal plasticity finite element modeling.
AM process modeling.
Data-driven modeling
Process optimization.
Defect control.
Material design.
Active Research Projects
Single PI, “CAREER: Understanding Dynamic Recrystallization Mechanisms in Hybrid In-situ Rolled Additive Manufacturing,” Sponsored by NSF.
Single PI, “EPSCoR Research Fellows: Origin of Radiation Tolerance of Additive Manufacturing Single-phase Concentrated Solid-solution Alloys,” Sponsored by NSF.
PI, “Design, Manufacturing and Testing of Advanced TBC Bond Coats for Hot Gas Path Hydrogen Turbine Components,” Sponsored by DOE.
PI, “Convergent Manufacturing of Multi-materials with Strengthened Metal-Ceramic Interface,” Sponsored by US Army Research Laboratory.
PI, “Establishing A Hierarchical Physical-Computational Material Design Framework” Sponsored by SMAE STRIve seed grant.
Co-PI, “Laser 3D Printing of Highly Compact Mobile Protonic Ceramic Fuel Cell System,” Sponsored by US ARMY VIPR-GS.
Co-PI, “An Integrated Multi-Material Digital Life Cycle Approach for Additive Manufacturing of Ground Vehicle Structures and Components.” Sponsored by U.S. ARMY Contracting Command, Department of Defense.
Co-PI, “Understanding the Role of Nanostructuring in Enhancing Phase Stability & Void Resistance of TiAl Intermetallic Alloys,” Sponsored by DOE-NE, CINT User Proposal.